Tsoft-20 is a thermally conductive material designed for use between transistors and heat sinks, offering low thermal resistance and electrical insulation without the need for thermal grease.
Standardized laboratory test data measured in accordance with ASTM D 1000, ASTM D 2979, and ASTM D 2671.
Physical Property
Test Method
Standard Test Units (US)
Metric Units (SI)
Total Thickness
ASTM D 1000
20 mils (0.0020 in)
0.508 mm
Thermal Transfer Ribbon Compatibility
Official Brady recommended ribbons engineered for maximum contrast, smear resistance, and UL certification compliance.
Recommended Thermal Transfer
Non-printable hardware, tag, or pre-printed material.
* Note: Testing print permanence with official Brady ribbons is required to maintain UL/CSA agency certification on printed labels.
Chemical & Solvent Resistance Matrix
Standardized dip and rub immersion test observations across industrial fuels, oils, solvents, and cleaners.
No standardized ASTM chemical dip/rub test data is published on the official Brady TDS for BT-8600.
Environmental & Aging Durability Testing
Environmental Exposure Condition
Observation & Legibility Result
20 Thermally Conductive Material Gap Filler - Material Spec (Brady BT-8600)
Material family
BT-8600
20 is a thermally conductive material designed for use between transistors and heat sinks, offering low thermal resistance and electrical insulation without the need for thermal grease.
## Verified specifications
- Construction