Tsoft-100 is a thermally conductive material designed for use between transistors and heat sinks, offering low thermal resistance and electrical insulation without the need for thermal grease.
Standardized laboratory test data measured in accordance with ASTM D 1000, ASTM D 2979, and ASTM D 2671.
Physical Property
Test Method
Standard Test Units (US)
Metric Units (SI)
Thermal Transfer Ribbon Compatibility
Official Brady recommended ribbons engineered for maximum contrast, smear resistance, and UL certification compliance.
Recommended Thermal Transfer
Non-printable hardware, tag, or pre-printed material.
* Note: Testing print permanence with official Brady ribbons is required to maintain UL/CSA agency certification on printed labels.
Chemical & Solvent Resistance Matrix
Standardized dip and rub immersion test observations across industrial fuels, oils, solvents, and cleaners.
No standardized ASTM chemical dip/rub test data is published on the official Brady TDS for BT-8605.
Environmental & Aging Durability Testing
Environmental Exposure Condition
Observation & Legibility Result
100 is a thermally conductive material designed for use between transistors and heat sinks, offering low thermal resistance and electrical insulation without the need for thermal grease.
## Verified specifications
- Construction
Silicone binder with aluminum oxide filler, fiberglass polyester reinforcement
Service temperature
-60 to 200 °C
Verified Target Applications & Use Cases
Industrial rating plates, asset identification, and electrical component labeling.