Tsoft3S-60 Thermally Conductive Material Gap Filler
Tsoft3S-60 is a thermally conductive material designed to manage heat in electronic applications, offering low thermal resistance and electrical insulation without the need for thermal grease.
Standardized laboratory test data measured in accordance with ASTM D 1000, ASTM D 2979, and ASTM D 2671.
Physical Property
Test Method
Standard Test Units (US)
Metric Units (SI)
Total Thickness
ASTM D 1000
60 mils (0.0060 in)
1.524 mm
Thermal Transfer Ribbon Compatibility
Official Brady recommended ribbons engineered for maximum contrast, smear resistance, and UL certification compliance.
Recommended Thermal Transfer
Non-printable hardware, tag, or pre-printed material.
* Note: Testing print permanence with official Brady ribbons is required to maintain UL/CSA agency certification on printed labels.
Chemical & Solvent Resistance Matrix
Standardized dip and rub immersion test observations across industrial fuels, oils, solvents, and cleaners.
No standardized ASTM chemical dip/rub test data is published on the official Brady TDS for BT-8622.
Environmental & Aging Durability Testing
Environmental Exposure Condition
Observation & Legibility Result
60 Thermally Conductive Material Gap Filler - Material Spec (Brady BT-8622)
Material family
BT-8622
60 is a thermally conductive material designed to manage heat in electronic applications, offering low thermal resistance and electrical insulation without the need for thermal grease.
## Verified specifications
- Construction
Silicone binder with aluminum oxide and boron nitride filler, fiberglass reinforcement
Service temperature (min)
-60 °C
Verified Target Applications & Use Cases
Industrial rating plates, asset identification, and electrical component labeling.