Brady LAM-5-103 Polyester Overlaminate Labels 0.5 in H x 1 in W Clear 2000/RL
Formulated from Brady B-103 ClearPolyester(1milfilm)Finish:GlossyAdhesive:PermanentAcrylic with permanent acrylic adhesive. Engineered for 1" W × 0.5" H industrial labeling applications.
Compatible Brady Printers & Thermal Transfer Ribbon Pairing
Verified hardware compatibility and recommended ribbon formulations for LAM-5-103.
Full Technical & Material Specifications (ASTM / UL Testing)
| Material Formulation: | Brady B-103 (B-103 Industrial Material) | Continuous Temp Range: | -40°F to 250°F (-40°C to 121°C) |
| Substrate Polymer Chemistry: | ClearPolyester(1milfilm)Finish:GlossyAdhesive:PermanentAcrylic | Total Material Thickness: | 0.004 in (0.102 mm) |
| Adhesive Formulation: | Permanent Acrylic | ASTM D1000 Stainless Steel Peel: | 50+ oz/in |
| ASTM D1000 Polypropylene Peel: | 35+ oz/in | ASTM D1000 Powder Coat Peel: | 40+ oz/in |
| UL 969 Recognition: | UL 969 (File MH17154 / MH10939) | CSA C22.2 Acceptance: | CSA C22.2 No. 0.15 |
| RoHS / Halogen Compliance: | RoHS Compliant • Standard Formulation | Surface Finish: | GlossyAdhesive:PermanentAcrylic |
Related Sibling SKUs & Alternate Formats
Engineering & Specifier FAQs for LAM-5-103
Can I print Brady LAM-5-103 on a standard portable printer?
LAM-5-103 is a bulk roll engineered for benchtop printers (such as the i3300, i5100, i7100, and PR Plus series) with 3-inch core diameter holders.
Is Brady LAM-5-103 recognized under UL 969 for electrical panel rating plates?
Yes, LAM-5-103 is manufactured from Brady B-103, which holds UL 969 component recognition under File MH17154 / MH10939 (PGJI2) when printed with approved thermal transfer ribbons (such as Series R6000HF).
How do I generate an official engineering submittal package for LAM-5-103?
Click the "1-Click Engineering Submittal PDF Package" button above to instantly generate a contractor-stamped specification packet with ASTM D1000 adhesion test data, continuous operating temperatures, and UL compliance certificates ready for architectural submittals.